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Thermal shock test for outdoor lighting products according to IEC60068

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The capacity of a product to endure rapid and severe shifts in temperature is one of the factors that may be evaluated using a technique called thermal shock testing. Due to the fact that outdoor lighting goods are subjected to a broad variety of temperatures and are required to be able to endure the pressures caused by temperature changes, this form of testing is particularly crucial for outdoor lighting products. The IEC60068 standard provides a comprehensive set of guidelines for ensuring the reliability and durability of outdoor lighting products in real-world conditions. It outlines the requirements for thermal shock testing of outdoor lighting products and outlines the requirements for testing these products. There are a few procedures that need to be performed in order to carry out a thermal shock test in accordance with the IEC60068 standard for outdoor lighting devices. In the first step of the process, the item to be tested must be exposed to a sudden shift in temperature

What is a thermal shock chamber used for?

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When doing environmental testing on a device or component, which includes subjecting it to quick and dramatic fluctuations in temperature, a thermal shock chamber is often employed. This kind of testing is intended to examine the device's or component's capacity to tolerate thermal stress and to locate any possible failure sites that might arise as a consequence of changes in temperature. For instance, a thermal shock chamber may be used as a testing environment for the functionality and longevity of electronic components, such as integrated circuits, when subjected to circumstances of very high temperatures. The component may be placed within the thermal shock chamber, and the temperature can be swiftly changed from a high level to a low one or vice versa by the manufacturer. The component is then monitored to see how well it functions and whether or not its performance has changed over the course of time. This information may be used to detect any possible failure sites an